Wednesday, November 20, 2013

SDM processing v1

With help of Eric from BDML, poured in hard urethane (Task 3) today:

Then, in the evening, I faced the hard urethane. I had some delamination issues (see below) and the "chips" seemed very sticky. I wonder if this has to do with the fact that the Task 3 part B was not properly shaken in the bottle prior to use:

Trajectory for the second pass machining, for the soft urethane:

Close up of result. I did not use a finishing pass and I did depth cuts of 1 mm. The Task 3 is not as nice to cut as the machinable wax, will use a more conservative trajectory next time:

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